Systems and methods for repetitive tuning of matching networks

ABSTRACT

A method for repetitive tuning of a matching network in a radio frequency plasma processing device, the method including detecting a condition within the matching network and determining if the condition is a known condition for the matching network. Also, finding a prior solution and to the condition when the condition is the known condition for the matching network; and replicating the prior solution for the condition in the matching network.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application and claims priority toU.S. Utility patent application Ser. No. 17/035,392, having the sameTitle and Inventorship as the instant application, which was filed Sep.28, 2020, the contents of which are incorporated herein by reference.

BACKGROUND

Radio frequency plasma-enhanced processing is extensively used insemiconductor manufacturing to etch different types of films, depositthin films at low to intermediate processing temperatures, and performsurface treatment and cleaning. Characteristic of such processes is theemployment of a plasma, i.e., a partially ionized gas, that is used togenerate neutral species and ions from precursors inside a reactionchamber, provide energy for ion bombardment, and/or perform otheractions. Radio frequency plasma-enhanced processing is performed by whatare known as radio frequency processing devices.

Radio frequency processing devices may include a radio frequencygenerator that transmits a signal to a plasma reaction chamber. A radiofrequency matching device, which may have a variable impedance, may belocated between the radio frequency generator and the plasma reactionchamber. The radio frequency matching device may be controlled, orotherwise tuned by varying the impedance of the radio frequency matchingdevice. Tuning the radio frequency matching device reduces reflectedpower from the plasma reaction chamber and/or the radio frequencymatching device, which may increase power that is transferred from theradio frequency generator to the plasma reaction chamber and into theplasma process.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying Figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale. In fact, the dimensions of the variousfeatures may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a schematic representation of a radio frequency plasmaprocessing device according to embodiments of the present disclosure.

FIG. 2 is a schematic representation of a matching network according toembodiments of the present disclosure.

FIG. 3 is a schematic representation of a plasma processing deviceaccording to embodiments of the present disclosure.

FIG. 4 is a graph showing a capacitor position prior to implementationof embodiments of the present disclosure.

FIG. 5 is a graph showing a capacitor position according to embodimentsof the present disclosure.

FIG. 6 is a flowchart of a method for tuning a matching network in aradio frequency plasma processing device according to embodiments of thepresent disclosure.

FIG. 7 is an example computing device with a hardware processor andaccessible machine-readable instructions in accordance with one or moreexamples of the present disclosure

FIG. 8 is a schematic representation of a computer processing devicethat may be used to implement functions and processes in accordance withone or more examples of the present disclosure

DETAILED DESCRIPTION

Illustrative examples of the subject matter claimed below will now bedisclosed. In the interest of clarity, not all features of an actualimplementation are described in this specification. It will beappreciated that in the development of any such actual implementation,numerous implementation-specific decisions may be made to achieve thedevelopers' specific goals, such as compliance with system-related andbusiness-related constraints, which will vary from one implementation toanother. Moreover, it will be appreciated that such a developmenteffort, even if complex and time-consuming, would be a routineundertaking for those of ordinary skill in the art having the benefit ofthis disclosure.

Further, as used herein, the article “a” is intended to have itsordinary meaning in the patent arts, namely “one or more.” Herein, theterm “about” when applied to a value generally means within thetolerance range of the equipment used to produce the value, or in someexamples, means plus or minus 10%, or plus or minus 5%, or plus or minus1%, unless otherwise expressly specified. Further, herein the term“substantially” as used herein means a majority, or almost all, or all,or an amount with a range of about 51% to about 100%, for example.Moreover, examples herein are intended to be illustrative only and arepresented for discussion purposes and not by way of limitation.

Embodiments of the present disclosure may provide systems and methodsfor tuning and otherwise controlling matching networks in radiofrequency plasma processing devices. During operation, a radio frequencygenerator may be energized to form a plasma within a reaction chamber.The plasma may be produced after a source gas is injected into thereaction chamber and power is supplied within the reaction chamber bythe radio frequency generator.

Under certain conditions, the power that is supplied to the reactionchamber may be reflected back from the reaction chamber. When power isreflected back, the process may be less efficient and/or wafers that arebeing processed may be damaged. The cause of the reflected power may bea mismatch in the impedance of the radio frequency generator and a loadformed by the plasma within the reaction chamber. To help preventreflected power, a matching network may be disposed between the radiofrequency generator and the reaction chamber. Such matching networks mayinclude a number of variable capacitors or other impedance elements. Thevariable capacitors may be tuned so that the complex load impedancewithin the reaction chamber matches the impedance of the radio frequencygenerator.

While multiple methods of controlling or otherwise tuning matchingnetworks have been used, such methods may not reliably and efficientlyresult in impedance matching. Methods of tuning matching networks mayinclude controlling the matching networks to control the current splitratio, which may minimize reflected power seen at the radio frequencygenerator. The current split ratio is the current split between, forexample, inner and outer source coils. Certain variable capacitors maybe used to control the current split ratio within a desired operationalrange.

Matching networks using current split ratio may have several drawbackincluding, for example, limited current split ratio ranges, high coilvoltages, coil arcing, and the like. Current matching networks usingcurrent split ratio that are not currently tuned may result in lessefficient operation, damage to radio frequency processing devicecomponents, and decreased yield due to undesired particulate depositionon wafers within the reaction chamber.

Embodiments of the present disclosure may provide systems and methodsfor the repetitive tuning of matching networks using current split ratiovalues that minimize, or at least address, the currently experiencedproblems identified above. In certain embodiments, capacitor positionsfor tuned impedance points may be learned, such that when a conditionexists, for example the current split ratio falls out of a desiredoperational range, there is a spike in reflected power, etc., thecapacitors may be automatically adjusted. The automatic adjustment mayoccur as a result of learned capacitor positions that may be used tocorrect the condition that is occurring within the plasma processingdevice. By learning capacitor positions that correct certain conditions,when a condition is detected, the matching networks may be automaticallytuned by applying a known solution that corrects the condition. Forexample, the known solution may include adjusting a property of one ormore capacitors within the matching network.

Such embodiments may provide enhanced efficiency for plasma processingby allowing faster and more accurate adjustments to matching networks.As such, the matching networks may be repetitively tuned duringprocessing, so that when a condition is detected, the known solution isapplied without taking additional time that would otherwisedetrimentally effect plasma processing. Additionally, when a conditionfor which there is not a known solution occurs, the capacitors may beadjusted, and when the condition is resolved, the solution may be storedfor future use, should the condition subsequently occur. Because thesolution may be stored, the matching networks may have access to anevolving database of solutions and recipes that allows plasma processingto become increasingly efficient. Exemplary systems and methods areprovided below.

Turning to FIG. 1, a side view schematic representation of a radiofrequency plasma processing system 100, according to embodiments of thepresent disclosure is shown. Radio frequency plasma processing system100 includes a first radio frequency generator 105 and a second radiofrequency generator 110, a first impedance matching network 115, asecond impedance matching network 120, a sheath 125, a plasma poweringdevice, such as showerhead 130 or equivalent powered element such as anelectrode, and a pedestal 135. As used herein, plasma power devices mayrefer to any device that introduces power to generate plasma and mayinclude, for example, showerhead 130 and/or other types of electrodes,as well as antennae and the like.

Radio frequency plasma processing system 100 may include one or morefirst and second radio frequency generators 105, 110 that deliver powerto a reaction chamber 140 through one or more impedance matchingnetworks 115, 120. Radio frequency power flows from the first radiofrequency generator 105 through the first impedance matching network 115to showerhead 130 into plasma in reaction chamber 140, to an electrode(not shown) other than showerhead 130, or to an inductive antenna (notshown) that electromagnetically provides power to the plasma. Afterwhich the power flows from the plasma to ground and/or to pedestal 135and/or to second impedance matching network 120. Generally, firstimpedance matching network 115 compensates for variations in a loadimpedance inside reaction chamber 140 so the combined impedance ofshowerhead 130 and first impedance matching network 115 equal the outputof first radio frequency generator 105, e.g., 50 ohms, by adjusting thereactive components (not separately shown), e.g., variable capacitors,within first impedance matching network 115.

In certain examples, first radio frequency generator 105 may providepower at a RF frequency between about 400 KHz and 150 MHz, while secondradio frequency generator 110 connected to pedestal 135 may supply powerat a radio frequency lower than that of first radio frequency generator105. However, in certain implementations, second radio frequencygenerator 110 may not supply power at a radio frequency lower than thatof first radio frequency generator 105. Typically, the frequencies offirst and second radio frequency generators 105, 110 are such that firstradio frequency generator 105 is at a radio frequency that is not aninteger multiple, nor integer fraction, of the frequency of second radiofrequency generator 110.

Impedance matching networks 115, 120 are designed to adjust theirinternal reactive elements such that the load impedance matches thesource impedance. In other examples of the plasma processing device 100,different numbers of radio frequency power generators 105/110 may beused, as well as different numbers of impedance matching networks115/120. Impedance matching networks 115/120 may include a number ofinternal components, such as coils and variable capacitors, which willbe discussed in greater detail below.

Turning to FIG. 2, a schematic representation of a matching networkaccording to embodiments of the present disclosure is shown. In thisembodiments, a matching network 200, such as those described above withrespect to FIG. 1, is illustrated having a matching branch 205 and asplitter branch 210. Matching branch 205 receives radio frequency powerfrom an input 215. A first variable capacitor 220 of the matching branch205 receives the radio frequency power from the input 215. Firstvariable capacitor 220 may include a capacitor rated at approximately10-2000 pF.

First variable capacitor 220 is connected to a second capacitor 225,which is connected to a ground 230. Second capacitor 225 is alsoconnected to a third variable capacitor 235. Third variable capacitor235 may include a capacitor rated at approximately 10-2000 pF. Thirdvariable capacitor 235 is also connected to an inductor 240, whichfurther connects to splitter branch 210.

Splitter branch 210 receives radio frequency power from matching branch205, which, splits the received radio frequency power between a fourthvariable capacitor 245 and a fifth variable capacitor 250. Fourthvariable capacitor 245 may be rated at approximately 10-2000 pF, whilefifth variable capacitor 250 may be rated at approximately 10-2000 pF.

Fourth variable capacitor 245 is connected to an inner coil 255. Betweenfourth variable capacitor 245 and inner coil 255, one or more sensors260 may be disposed. Sensor 260 may be used to measure, for example,voltage between fourth variable capacitor 245 and inner coil 255.Similarly, fifth variable capacitor 250 is connected to an outer coil265. Between fifth variable capacitor 250 and outer coil 265, one ormore sensors 270 may be disposed. Sensors 270 may be used to measure,for example, voltage between fifth variable capacitor and outer coil265.

Inner coil 255 may further be connected to a ground 275 and outer coil265 may be connected to circuitry that include a sensor 280 and a sixthcapacitor 285. Sensor 280 may be used to measure, for example, voltagebetween outer coil 265 and sixth capacitor 285, which is connected to aground 290. Inner coil 255 and outer coil 265 may be located outside ofthe matching network 200 circuitry, as indicated by offset box 295.

As discussed above, the circuitry illustrated in FIG. 2 may be used totune first variable capacitor 220, third variable capacitor 235, fourthvariable capacitor 245, and fifth variable capacitor 250. By tuningfirst variable capacitor 220, third variable capacitor 235, fourthvariable capacitor 245, and fifth the power provided to inner coil 255and outer coil 265 may be adjusted.

The circuitry, which in one embodiment may be employed in matchingnetwork 200 as a current split ratio matching network, may be controlledusing a programmable logic controller (not shown), which may be disposedin or otherwise connected to matching network 200. Suitable programmablelogic controllers and associated components will be discussed furtherwith respect to FIG. 3.

In other embodiments, the circuitry of matching network 200 may includefewer or additional components, and the orientation of the circuitry maydiffer. For example, fewer or greater numbers of variable capacitors,inductors, sensors, and the like may be present. Additionally, incertain embodiments, a different orientation of coils, antennas, and thelike may be used to provide tuned radio frequency power to a reactionchamber (not shown in FIG. 2). Systems and methods disclosed herein maybe used with transformer coupled plasmas (“TCPs”), inductively coupledplasmas (“ICPs”), capacitively coupled plasmas (“CCPs”), helicon wavesources (“HWSs”), or any other plasma processing devices.

Turning to FIG. 3, a schematic representation of a radio frequencyplasma processing device according to embodiments of the presentdisclosure is shown. In this embodiment, a radio frequency plasmaprocessing device 300 includes a radio frequency generator 305. Radiofrequency generator 305 is configured to provide power to reactionchamber 310. Radio frequency generator 305 may provide power at a radiofrequency between about 400 KHz and about 150 KHz. In certainembodiments, a second radio frequency generator (not shown) may also bepresent within radio frequency plasma processing device 300 and mayprovide power at a radio frequency that is the same, lower, or higherthan radio frequency generator 305.

Reaction chamber 310 may include various components that allow for theprocessing of a manufacturing operation, such as those associated withthe semiconductor industries. Reaction chamber 310 may include one ormore sensors (not shown) for measuring certain properties occurringwithin reaction chamber 310. Reaction chamber 310 may also include apedestal (not shown) on which substrates to be manufactured may beplaced during operation. Reaction chamber 310 may also include orotherwise be connected to coils (not individually shown), such as thosediscussed above, as well as showerheads, etc.

Radio frequency plasma processing device 300 may also include a matchingnetwork 315. Matching network 315 may be located between radio frequencygenerator 305 and reaction chamber 310. Matching network 315 may includevariable capacitors (not shown), as well as other components to balanceimpedance between radio frequency generator 305 and reaction chamber310, as discussed in greater detail above. During operation, thematching network may be tuned, e.g., by adjusting capacitor positions,in order to provide the matching impedances.

In order to provide faster tuning and repeatability in manufacturingprocesses, matching network 315 may be connected to a tuning module 317.Tuning module 317 may include one or more programmable logic controllers320. Programmable logic controller 320 may have access to a storagedevice 325, such as memory, which in certain embodiments may include anon-transitory computer readable medium that is configured to storecomputer executable instructions. Storage device 325 may be integratedwithin tuning module 317 or may be located remotely at a separatephysical location. Storage device 325 may be directly connected toprogrammable logic controller 320, as is illustrated in FIG. 3, while inother embodiments, storage device 325 may be remote from programmablelogic controller 320. For example, storage device 325 may be connectedto programmable logic controller 320 through a wired or wirelessconnection, thereby allowing storage device 325 to be located at adifferent physical location from radio frequency plasma processingdevice 300.

Programmable logic controller 320 may be connected to matching network315 through various types of connections 330. For example, connections330 may include wired connections or wireless connections. In stillother embodiments, matching network 315 may include a tuning module 337that has a programmable logic controller 335, including a storage device340, that is located in or on matching network 315. Programmable logiccontrollers 320 and 335 may function the same, regardless of theirlocation with respect to matching network 310 and/or radio frequencyplasma processing device 300.

During operation, as power is supplied from radio frequency generator305 to plasma (not shown) within reaction chamber 310, a condition mayoccur, such as power may be reflected from reaction chamber 310. Suchreflected power may result in undesirable conditions within reactionchamber 310, which result in inefficient processing, damage to asubstrate, damage to components of radio frequency plasma processingdevice 300, and the like. To resolve the condition and improveoperability of radio frequency processing device 300 programmable logiccontrollers 320 or 335 may provide commands to matching network 315 toadjust a capacitor position, thereby providing matching impedances tominimize reflected power.

Storage device 325 or 340 may contain a database of known conditionsthat occur within radio frequency processing device 300 duringoperation. The known conditions may be associated with values of radiofrequency generator 305, matching network 315, reaction chamber 310,and/or various components thereof. For example, a condition may beassociated with a certain level of power provided by radio frequencygenerator 305 and matching network 315 capacitor positions. When thecondition is detected, programmable logic controller 320 may executeinstructions/commands to search a database of known conditions withinstorage device 325. When a known condition is identified within thedatabase, the known condition may be associated with a prior solution.Programmable logic controller 320 may then execute instructions toreplicate the prior solution within matching network 315 in order toresolve the condition within radio frequency processing device 300.

The prior solution, in this particular example, refers to empirical datathat was collected when the condition previously occurred. For example,if a condition is detected, but it is determined that the condition isnot a known condition, and as such, there is not a prior solution,aspects of matching network 315 or other components of radio frequencyprocessing device 300 may be adjusted. When the condition is resolved, aprior solution may then be associated with a known condition. The knowncondition may then be saved in the database for future use. As such,when the condition occurs again, when the database is searched for aknown condition, the known condition may be found associated with aprior solution. The prior solution may then be applied without having tospend additional time determining the solution to the condition. Assuch, the speed of resolving a condition within radio frequencyprocessing device 300 may be increased, thereby resulting in improvedmanufacturing efficiency, etc.

The known conditions may be created as specified above, throughcollecting data during operation, and saving the data for future use.The known conditions may also be imported from other radio frequencyprocessing devices 300. A network of radio frequency processing devices300 may be created, thereby increasing data in the database faster. Forexample, radio frequency processing device 300 may experience acondition, for which no known solution is found in its database.However, the solution may be in a network database accessible byprogrammable logic controllers 320 or 335. The known condition may haveoccurred in a second radio frequency processing device (not shown). Asthe data is accessibly by programmable logic controllers 320 or 335 ofradio frequency processing device 300, the condition may still beresolved faster because the known condition had already occurred in adifferent radio frequency processing device.

Because the conditions, known conditions, and prior solutions are basedon empirical data, there is greater accuracy in applying a solution to acondition. Solutions for conditions based on guesses, e.g., thesolutions are not based on actual data, may not work, or may not work aswell as solutions created by the empirical data. Additionally, because aprior solution for a condition is known to have been effective, there isgreater repeatability in the application of the solution, therebyimproving efficiency of the operation.

In certain embodiments, current split ratio s may be stored in thedatabase/data structure and used to identify a condition. For example, acalculated current split ratio may be, or may be associated with, acondition, thereby allowing a known condition to be stored in thedatabase. The current split ratio may be associated with a priorsolution, such as a capacitor position for a tuned impedance point. Assuch, the current split ratio may be used to identify a known conditionand thereby allow a prior solution to be applied within matching network315.

The database in storage device 325 or programmable logic controller 335may also be uploaded with data provided by operators. For example, anoperator may upload various known conditions, current split ratios,prior solutions, and the like, the further increase the robustness ofthe available data. In still other embodiments, operational recipes,such as recipe specific current split ratio tables may be stored instorage device 325 or programmable logic controller 335, thereby makingentire recipes for specific operations available. By storing the recipesfor specific operations, matching network 315 may me adjust more quicklywhen conditions occur, or otherwise preventing conditions from occurringin the first place. In either instance, the effectiveness of themanufacturing process may be increased.

In embodiments, such as those discussed above with respect to FIG. 2,where two coils are used, capacitors associated with the inner and outercoils, i.e., fourth capacitor and fifth capacitor may be allowed to tunewith high reflected power at limited speed. Values for specificcapacitors, such as first capacitor, third capacitor, fourth capacitor,and/or fifth capacitor of FIG. 2 may be stored and or associated withconditions, thereby allowing the capacitors to be adjusted duringoperation. Additionally, the speed of capacitors may be controlled basedon a percentage of reflected power. Furthermore,

As conditions occur that are not known, and solutions are generated forthe unknown conditions, prior solutions may be associated in thedatabase with specific conditions. The longer radio frequency processingdevice 300 operates, the more conditions will occur, and thus, the moresolutions will be generated. In view of the number of conditions thatmay occur, tuning module 337 may be trained with respect to conditionsand solutions. As such, the process allows the executable instructionsto learn over time, thereby resulting in a larger database of knownconditions and solutions, which further increases the speed of resolvingconditions.

Additionally, because programmable logic controller 320 or programmablelogic controller 335 has access to a database of empirical data, recipetables, known conditions, prior solutions, etc., the process can besubstantially automated. As such, during operation the capacitors inmatching network 315 may be automatically tuned to specific positions.Such auto-tuning of capacitor position may thereby increase the speed ofresolving conditions, as well as increase operational efficiency. Thelearning, as discussed above, may also occur automatically, therebycreating real-time updates to the stored data.

Turning to FIG. 4, a graph showing a capacitor position according priorto implementation of embodiments of the present disclosure is shown. They-axis is a capacitor position in percentages, while the x-axis is timein seconds. This graph shows a recipe cycle that involves multiplecurrent split ratio condition, e.g., twenty, which is represented byreference character 400. A second cycle is represented by referencecharacter 405. The cycle may then continue to repeat, as evidenced byadditional cycles 410, 415, 420, 425, 430, 435, and 440. As the recipecontinues over time, the capacitor positions drift downward because thecapacitor does not have a single value that resolves a current splitcondition, which results in infinite solutions. Eventually, thecapacitor is not able to find a satisfactory position to turn thecurrent split ratios and rails out, as is evidenced in last cycle 445.

Turning to FIG. 5, a graph showing a capacitor position according toembodiments of the present disclosure is shown. The y-axis is acapacitor position in percentages, while the x-axis is time in seconds.In this embodiment, the matching network has learned the capacitorpositions from a first cycle 500. As such, for each following cycle, thecapacitor drives to corresponding positions as were learned in firstcycle 500. Cycles 505, 510, 515, 520, 525, and 530 illustrate thatcapacitor position in employing such a matching network do not driftover time, and the recipe continues to be tuned. Embodiments of thepresent disclosure may thereby allow capacitor positions to becontinuously tuned to achieve optimized operating conditions.

Turning to FIG. 6, a flowchart of a method for tuning a matching networkin a radio frequency plasma processing device, according to embodimentsof the present disclosure is shown. In operation, method 600 includesdetecting (block 605) a condition within the matching network. Thecondition may include any of the conditions identified above including,for example, a spike or increase in reflected power. The condition maybe identified by one or more sensors located in a reaction chamber,within a matching network, or disposed on or about another component ofan associated radio frequency processing device. In certain embodiments,the condition may be recorded and stored in a storage device associatedwith a tuning module. Depending on the condition being sensed, thesensors may be located in various locations one or about the radiofrequency plasma processing device. The recorded and stored conditionmay then later be used in processing data, identifying condition, andthe like.

In operation, method 600 may further include determining (block 610) ifthe condition is a known condition for the matching network. Todetermine if the condition is known, a programmable logic controller, orother processing device, may access the storage device to search forexisting known conditions. The known conditions may be stored as adatabase, in tables, etc., thereby allowing access by the programmablelogic controller to all existing known conditions. The known conditionsmay be stored locally or may be located at a remote location.

In operations when, a known condition is not found, the condition thatwas detected may be recorded in the storage device as a known condition.The known condition may then be available in the future during thedetecting and determining aspects of method 600. In certain embodiments,the condition that is recorded may include recording a capacitorposition associated with the detected condition.

In operation, method 600 may further include finding (block 615) a priorsolution to the condition when the condition is known for the matchingnetwork. When a known condition is identified, the known condition maybe associated with a prior solution. The known condition had previouslyoccurred, and a solution for the condition was identified. Thus, foreach known condition stored in the database there is a correspondingprior solution. Furthermore, if a known condition is not found, there isno prior solution. During operation to resolve the condition, which isnow a known condition, a solution is identified. Upon identification ofthe solution, the solution becomes a prior solution that is associatedwith a known condition. As such, the database, tables, etc., thatinclude known conditions and prior solutions continues to evolve,through for example, machine learning. As more conditions occur, therobustness of the known prior solutions also increases, therebyincreasing the effectiveness of the process. In aspects where thecondition that is recorded includes recording a capacitor positionassociated with the detected condition, the recorded capacitor positionmay be associated with a prior solution.

In operation, method 600 may further include replicating (block 620) theprior solution for the condition in the matching network. Thereplication of the solution may include applying the prior solutionthrough, for example, the programmable logic controller, or otherprocessing device, to the matching network. The prior solution mayinclude, for example, setting capacitor positions for one or morecapacitors within the matching network. Because there is a priorsolution available for the condition, the capacitor position to correctthe condition is known, and may thus be applied without the trial anderror approach, which may be necessary for an unknown condition or priorsolution. As such, the process of replicating the prior solution may beautomated, along with the detecting, determining, and finding,identified above. Through automation, a tuning module, which wasdiscussed above with respect to FIG. 3, may more quickly detect acondition and replicate a solution, which in turn increases operationalefficiency.

In certain embodiments, the known condition may be determined orpreviously determined using an empirical data set. The empirical dataset may include actual values captured during operation of the matchingnetwork, radio frequency processing device, and the like. In certainembodiments, the empirical data set may include current split ratios.The empirical data may be stored in the storage device and be accessedby the programmable logic controller or other processing device. Theempirical data may be analyzed by the programmable logic controller andbe associated with conditions, known condition, and prior solutions.Thus, the use of empirical data may allow the solutions to be customizedfor a specific condition, operation, matching network, radio frequencyplasma processing device, or other component.

The solution, in certain embodiments, may include a capacitor positionthat is tuned to a known impedance point. The solution may affect asingle capacitor, or in other types of matching networks, the solutionmay affect two, three, four, or more capacitors. The solution mayfurther adjust other aspect of the matching network.

In certain operations, when the detection occurs, the condition that isdetected may not meet a threshold for a known condition, and in suchsituations method 600 may be discontinued. This may occur, for example,if a value for a parameter of the matching network is not as desired,but does not exceed an operational threshold, so no prior solution isreplicated. In certain aspects, for example, a current split ratio maybe not be an ideal value, but may be within a tolerance, so no furtheraction is taken. In another example, a current split ratio may be out ofa desired operational range but does not match a known condition. Insuch a situation, a solution would have to be found, and the currentsplit ratio value and solution would be saved to the database as a knowncondition and a prior solution.

In certain embodiments, replicating the prior solution may includecontrolling a capacitor speed based on a percentage of reflected power.This is another solution to an identified condition, which may includeallowing at least one capacitor in a matching network to tune with ahigher reflected power at a limited speed

In certain embodiments, the prior solution may include a solution thatincreases operational efficiency, decreases reflected power morequickly, prevents capacitor railing during operation, or otherwiseimproves overall tuning time.

Turning now to FIG. 7, an example computing device with a hardwareprocessor and accessible machine-readable instructions is shown inaccordance with one or more examples of the present disclosure. FIG. 7provides the same structural components discussed above with respect toFIG. 6, and as such, for purposes of clarity, only the differences inthe figures will be discussed herein. FIG. 7 provides an examplecomputing device 625, with a hardware processor 630, and accessiblemachine-readable instructions stored on a machine-readable medium 635for managing data as discussed above with respect to one or moredisclosed example implementations. FIG. 6 illustrates computing device625 configured to perform the flow described in blocks 605, 610, 615,and 620, discussed in detail with respect to FIG. 5. However, computingdevice 625 may also be configured to perform the flow of other methods,techniques, functions, or processes described in this disclosure.

Referring now to FIG. 8, a schematic representation of a computerprocessing device 700 that may be used to implement functions andprocesses in accordance with one or more examples of the presentdisclosure is shown. FIG. 7 illustrates a computer processing device 700that may be used to implement the systems, methods, and processes ofthis disclosure. For example, computer processing device 700 illustratedin FIG. 7 could represent a client device or a physical server deviceand include either hardware or virtual processor(s) depending on thelevel of abstraction of the computing device. In some instances (withoutabstraction), computer processing device 700 and its elements, as shownin FIG. 7, each relate to physical hardware. Alternatively, in someinstances one, more, or all of the elements could be implemented usingemulators or virtual machines as levels of abstraction. In any case, nomatter how many levels of abstraction away from the physical hardware,computer processing device 700 at its lowest level may be implemented onphysical hardware. In one implementation, computer processing device 700may allow a subscriber to remotely access one or more data centers.Similarly, the management tool used by the subscriber may include asoftware solution that runs on such a computer processing device 700.

FIG. 7 shows a computer processing device 700 in accordance with one ormore examples of the present disclosure. Computer processing device 700may be used to implement aspects of the present disclosure, such asaspects associated with the tuning module, the matching network, orother components of a radio frequency plasma processing device. Computerprocessing device 700 may include one or more central processing units(singular “CPU” or plural “CPUs”) 705 disposed on one or more printedcircuit boards (not otherwise shown). Computer processing device 700 mayfurther include any type of processing deice or programmable logiccontroller known in the ark.

Each of the one or more CPUs 705 may be a single-core processor (notindependently illustrated) or a multi-core processor (not independentlyillustrated). Multi-core processors typically include a plurality ofprocessor cores (not shown) disposed on the same physical die (notshown) or a plurality of processor cores (not shown) disposed onmultiple die (not shown) that are collectively disposed within the samemechanical package (not shown). Computer processing device 700 mayinclude one or more core logic devices such as, for example, host bridge710 and input/output (“IO”) bridge 715.

CPU 705 may include an interface 708 to host bridge 710, an interface718 to system memory 720, and an interface 723 to one or more IOdevices, such as, for example, graphics processing unit (“GFX”) 725. GFX725 may include one or more graphics processor cores (not independentlyshown) and an interface 728 to display 730. In certain embodiments, CPU705 may integrate the functionality of GFX 725 and interface directly(not shown) with display 730. Host bridge 710 may include an interface708 to CPU 705, an interface 713 to IO bridge 715, for embodiments whereCPU 705 does not include interface 718 to system memory 720, aninterface 716 to system memory 720, and for embodiments where CPU 705does not include integrated GFX 725 or interface 723 to GFX 725, aninterface 721 to GFX 725.

One of ordinary skill in the art will recognize that CPU 705 and hostbridge 710 may be integrated, in whole or in part, to reduce chip count,motherboard footprint, thermal design power, and power consumption. IObridge 715 may include an interface 713 to host bridge 710, one or moreinterfaces 733 to one or more IO expansion devices 735, an interface 738to keyboard 740, an interface 743 to mouse 745, an interface 748 to oneor more local storage devices 750, and an interface 753 to one or morenetwork interface devices 755.

Each local storage device 750 may be a solid-state memory device, asolid-state memory device array, a hard disk drive, a hard disk drivearray, or any other non-transitory computer readable medium. Eachnetwork interface device 755 may provide one or more network interfacesincluding, for example, Ethernet, Fibre Channel, WiMAX, Wi-Fi,Bluetooth, EtherCAT, Device Net, Mod Bus, RS-232, or any other networkprotocol suitable to facilitate networked communications. Computerprocessing device 700 may include one or more network-attached storagedevices 760 in addition to, or instead of, one or more local storagedevices 750. Network-attached storage device 760 may be a solid-statememory device, a solid-state memory device array, a hard disk drive, ahard disk drive array, or any other non-transitory computer readablemedium. Network-attached storage device 760 may or may not be collocatedwith computer processing device 700 and may be accessible to computerprocessing device 700 via one or more network interfaces provided by oneor more network interface devices 755.

One of ordinary skill in the art will recognize that computer processingdevice 700 may include one or more application specific integratedcircuits (“ASICs”) that are configured to perform a certain function,such as, for example, hashing (not shown), in a more efficient manner.The one or more ASICs may interface directly with an interface of CPU705, host bridge 710, or IO bridge 715. Alternatively, anapplication-specific computing device (not shown), sometimes referred toas mining systems, may be reduced to only those components necessary toperform the desired function, such as hashing via one or more hashingASICs, to reduce chip count, motherboard footprint, thermal designpower, and power consumption. As such, one of ordinary skill in the artwill recognize that the one or more CPUs 705, host bridge 710, IO bridge715, or ASICs or various sub-sets, super-sets, or combinations offunctions or features thereof, may be integrated, in whole or in part,or distributed among various devices in a way that may vary based on anapplication, design, or form factor in accordance with one or moreexample embodiments. As such, the description of computer processingdevice 700 is merely exemplary and not intended to limit the type, kind,or configuration of components that constitute a computing devicesuitable for performing computing operations, including, but not limitedto, hashing functions. Additionally, one of ordinary skill in the artwill recognize that computing device 700, an application specificcomputing device (not shown), or combination thereof, may be disposed ina standalone, desktop, server, or rack mountable form factor.

One of ordinary skill in the art will recognize that computing device700 may be a cloud-based server, a server, a workstation, a desktop, alaptop, a netbook, a tablet, a smartphone, a mobile device, and/or anyother type of computing device in accordance with one or more exampleembodiments.

In certain embodiments, advantages of the present disclosure may providefor computer executable instructions for automatically tuning capacitorsassociated with matching networks in radio frequency plasma processingdevices.

In certain embodiments, advantages of the present disclosure may provideimproved repeatability of tuning of capacitors associated with matchingnetworks in radio frequency plasma processing devices.

In certain embodiments, advantages of the present disclosure may providefaster tuning of capacitors associated with matching networks in radiofrequency plasma processing devices.

In certain embodiments, advantages of the present disclosure may providea method for a tuning module to learn as conditions occur, therebyincreases a number of known solutions for particular conditions.

In certain embodiments, advantages of the present disclosure may providea method for storing specific recipes for operation, which may includespecific current split ratio tables, which may decrease the number ofconditions that occurring during operation.

In certain embodiments, advantages of the present disclosure may providesystems and methods to decrease reflected power in radio frequencyplasma processing devices.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the disclosure.However, it will be apparent to one skilled in the art that the specificdetails are not required to practice the systems and methods describedherein. The foregoing descriptions of specific examples are presentedfor purposes of illustration and description. They are not intended tobe exhaustive of or to limit this disclosure to the precise formsdescribed. Obviously, many modifications and variations are possible inview of the above teachings. The examples are shown and described inorder to best explain the principles of this disclosure and practicalapplications, to thereby enable others skilled in the art to bestutilize this disclosure and various examples with various modificationsas are suited to the particular use contemplated. It is intended thatthe scope of this disclosure be defined by the claims and theirequivalents below.

What is claimed is:
 1. A method for repetitive tuning of a matchingnetwork in a radio frequency plasma processing device, the methodincluding: detecting a condition within the matching network;determining if the condition is a known condition for the matchingnetwork; finding a prior solution to the condition when the condition isthe known condition for the matching network; and replicating the priorsolution for the condition in the matching network.
 2. The method ofclaim 1, wherein the known condition is determined using an empiricaldata set. The method of claim 2, wherein the empirical data setcomprises current split ratios.
 4. The method of claim 3, furthercomprising storing the empirical data in a storage medium accessible bya programmable logic controller that is connected to the matchingnetwork.
 5. The method of claim 1, wherein the prior solution comprisesa capacitor position that is tuned to a known impedance point.
 6. Themethod of claim 1, wherein the detecting, determining, finding, andreplicating are automatic when the condition occurs within the matchingnetwork.
 7. The method of claim 1, further comprising determining thatthe condition does not meet a threshold to determine if the condition isthe known condition for the matching network and discontinuing themethod for tuning the matching network.
 8. The method of claim 1,wherein the replicating the prior solution comprises controlling acapacitor speed based on a percentage of reflected power.
 9. The methodof claim 1, further comprising allowing at least one capacitor to tunewith a reflected power at a pre-defined speed.
 10. The method of claim1, further comprising recording a capacitor position for the detectedcondition.
 11. The method of claim 10, further comprising associatingthe recorded capacitor position for the detected condition with theprior solution.
 12. The method of claim 1, wherein the prior solutiondecreases tuning times in the matching network.
 13. The method of claim1, wherein the prior solution prevents capacitor railing duringoperation.
 14. A radio frequency plasma processing device comprising: areaction chamber; a radio frequency generator to supply radio frequencypower to a plasma in the reaction chamber; a matching networkcomprising: a matching branch having a first variable capacitor and asecond variable capacitor; and a splitter branch having a third variablecapacitor and a fourth variable capacitor that are electricallyconnected to the first variable capacitor and the second variablecapacitor; an outer coil connected to the third variable capacitor; aninner coil connected to the fourth variable capacitor; and aprogrammable logic controller connected to the matching network, theprogrammable logic controller to: detect a condition within the matchingnetwork; determine if the condition is a known condition for thematching network; find a prior solution to the condition when thecondition is the known condition for the matching network; and replicatethe prior solution for the condition in the matching network.
 15. Theradio frequency plasma processing device of claim 14, further comprisinga tuning module connected to the matching network, the tuning module tostore at least the condition and the prior solution.
 16. The radiofrequency plasma processing device of claim 15, wherein the tuningmodule stores empirical data comprising transformer coupled capacitivelytuning ratios.
 17. The radio frequency plasma processing device of claim15, wherein a tuned capacitor position for at least one of the firstvariable capacitor, the second variable capacitor, the third variablecapacitor, and the fourth variable capacitor is recorded and stored bythe tuning module.
 18. The radio frequency plasma processing device ofclaim 14, wherein the programmable logic controller receives values fromat least one sensor associated with at least the third variablecapacitor and the fourth variable capacitor.
 19. The radio frequencyplasma processing device of claim 14, wherein a tuned capacitor positionfor at least one of the first variable capacitor, the second variablecapacitor, the third variable capacitor, and the fourth variablecapacitor is recorded and stored by the memory module.
 20. Anon-transitory computer readable medium comprising computer executableinstructions stored thereon that, when executed by one or moreprocessing units cause the one or more processing units to: detect acondition within the matching network; determine if the condition is aknown condition for the matching network; find a prior solution to thecondition when the condition is the known condition for the matchingnetwork; and replicate the prior solution for the condition in thematching network.